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- Intel to Release 3D-stacked Lakefield chips - June 15, 2020
Intel’s 3D-stacked Lakefield processors are about to hit the market. After creating great buzz in the market with amazing previews, Intel is all set to launch #D-stacked Lakefield Chips. Intel is promising to give small ultraportable, foldable and dual-screen devices. The product will give tough competition to ARM.
The new “Intel Core processors with Intel Hybrid Technology” is coming up with two major technologies on its chipsets. It is coming with hybrid cores and compact stacked Foveros 3D design.
The new chips are especially created to power small, ultralight devices. The release of first three devices announced by Intel few days ago. The Intel version of the Galaxy Book S, the foldable Lenovo ThinkPad X1 Fold and the dual-screen Surface Neo are coming in the market to dominate.
Intel is launching those products during pandemic and it can affect the sales.